The Material Outgassing Characterization test was initially developed to assist the microelectronic and optoelectronic component manufacturers. However, its broad scope of application makes it a powerful tool to address the needs of a larger community.
The study and prevention of problems that may occur during product life are of utmost interest and each element may require a detailed evaluation such as :
- Getter efficiency
- Epoxy cure cycle
- Adhesive moisture content
- Hydrogen desorption from Kovar packages and Au/Ni plating
- Raw material outgassing
- Chemical reaction by-products
- Bake out studies
Screen material performance and compatibility to select suitable products.
Compare suppliers for material performance and preparation (i.e. : adhesives cure cycle, ...).
Characterize the stability of materials under thermal stress (i.e. : curing, burn-in, thermal cycling, environmental tests, ...).
Trace failure sources by knowing the outgassing signature of each material present in the cavity of a device.
For detailed information, read the Outgassing Characterization with Glass Ampoules article.